$50 million award: Samsung, Ericsson, IBM and Intel together working on next-generation chips

According to the latest information, Ericsson, IBM, Intel, and Samsung together working on next-generation chips. Regarding the matter, the US National Science Foundation (NSF) has awarded $50 million to an R&D partnership. Eenewseurope reported that the partnership is part of NSF’s Future of Semiconductors (FuSe) initiative.

“Future semiconductors and microelectronics will require transdisciplinary research spanning materials, devices, and systems, as well as the engagement of the full spectrum of talent in the academic and industrial sectors,” said NSF Director Sethuraman Panchanathan. “Partnerships such as this are essential to inform research needs, spur innovation, accelerate the translation of results to the market, and prepare the future workforce.”

NSF will these partners surely invest in multiple projects across a broad front but based on “co-design” approaches, the NSF said. The partnership will take semiconductor development to the next level.

These were a partnership with the Semiconductor Research Corporation, a $10 million funding with Intel, and $10 million partnership with Micron Technology Inc.

Samsung, Ericsson, IBM and Intel

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