As per IT House news on January 10, TSMC schedule a 3nm mass production and expansion ceremony in Tainan Science Park in December. Whereby, it officially announced the start of 3nm mass production. However, Samsung initiated N3 (3nm) process chip manufacturing a half year back. While it seems that the production yield has seriously reduced due to the recent adoption of GAA.
Believing on TSMC’s statement, then its yield at the start of 3nm and 5nm is nearly the same. To be more specific then when Samsung’s 3nm GAA was first brought into production. The yield rate was only a pitfall of 20% while the scrap rate was substantially high. Meanwhile, there have news came out recently that Samsung’s 3nm yield has been greatly improved and is now “close to perfect“.
According to South Korea’s Daily Economic News. One of the Samsung executives revealed in an interview that, with respect to the previous trapped yield problem. Samsung’s first generation 3nm process yield is close to perfect. Concurrently, the second generation 3nm chip tech has also developed at a fast pace.
With Samsung and TSMC, the 3nm process will become the mainstream
It is being reported by IT House that TSMC initiate mass production of 3nm FinFET chips at the end of last year. Also, as per a report by Business Next, an expert specializing in semiconductor research. The yield of TSMC’s 3nm process was predicted to be about 60-70% at the end of the year. While in some cases, more than 70%.
As reported by Korean media, Samsung and TSMC have entered into the 3nm era. The future of the 3nm process will become the mainstream of the wafer foundry market. Thus, it is expected that by 2025, the value of the 3nm process market will reach 25.5 billion US dollars. This value is exceeding the estimated value of 19.3 billion US dollars for a 5nm process by that time respectively.
