Samsung Electronics Aims to increase its wafer production capacities for memories and system semiconductors by around 10 percent in 2023.
The progress seems to jump due to the sharp contrast between rivals such as TSMC, Intel, Micron Technology, and SK Hynix.
The company is said to establish new DRAM and semiconductor foundry lines with a capacity of producing 100,000 12-inch sheets of wafer per month at its third plant (P3) in Pyeongtaek, Gyeonggi Province, by the second half of next year.
In the new production, there are 70,000 sheets of the wafer will be added to Samsung’s current lines, which can produce about 20,000 12-inch wafer sheets per month. For reference, Samsung Electronics produced a total of 665,000 sheets of wafer per month for DRAM production in the third quarter. This new facility is expected to mass-produce advanced 12-nm DRAMs recently announced by Samsung.
Samsung will also be looking to expand the P3 plant’s wafer production capacity for foundry operation by 30,000 sheets next year. It will run a new 4-nm line.
