Samsung Electronics Chairman Lee Jae-yong has now visited the Dong-A Plating, a medium-sized company located in Noksan National Industrial Complex in Busan.
According to the information, Dong-A Plating is a small and medium-sized company specializing in electro-zinc surface treatment. Since 2018, Samsung Electronics has received support for building a smart factory three times.
“We must create a healthy ecosystem to achieve a virtuous cycle,” Lee said after touring around the manufacturing site.
Prior to this visit, Chairman Lee attended the first shipment ceremony for flip-chip ball grid arrays (FCBGA) for servers held at Samsung Electro-Mechanics’ Busan plant.
Meanwhile, Samsung Electro-Mechanics’ FCBGA reduces power consumption by 50 percent. Samsung Electro-Mechanics’ FCBGA for server has realized more than 60,000 terminals finer than the thickness of a human hair on a board the size of a business card, and reduced power consumption by 50% with EPS (Passive Components Embedded Technology) technology that embeds passive elements in a board less than 1mm thin.
Additionally the global semiconductor package substrate market is expected to grow to $16.5 billion in 2027.