Reportedly, Samsung Electronics hired TSMC Executive Lin Jun-cheng as a vice president who worked for nearly 19 years at TSMC. The recruitment is about speeding up the development of advanced packaging technology.
Vice President Lin is an expert in semiconductor packaging who worked at TSMC from 1999 to 2017. During this period, he orchestrated TSMC’s applications for more than 450 U.S. patents. Lin is credited with contributing to laying the groundwork for 3D packaging technology which TSMC is currently excelling at. Prior to joining TSMC, Lin also worked for Micron Technology, an American memory semiconductor company. Also, right before joining Samsung Electronics, Lin worked as the CEO of Skytech, a semiconductor equipment company in Taiwan, and accumulated production experience for packaging equipment.
The South Korean tech giant is also recruiting talented people. For your information in 2022, Samsung Electronics created an advanced packaging commercialization task force under the direct control of DS Division President Kyung Kye-hyun.
Meanwhile before recruiting Vice President Lin, Samsung Electronics brought in Vice President Kim Woo-pyung from Apple and appointed him as the head of the US Packaging Solution Center to reinforce human resources.