The chipmaker Qualcomm now has tech that could make eSIMs obsolete when has baked iSIM or Integrated SIM functionality right inside the Snapdragon 8 Gen 2 platform….!!
As the it makes swapping services much smoother and faster thus found highly attractive in the same era. Unlike eSIMs, iSIMs are located on the main processor of a phone. This means the tech takes up much lesser space inside the device compared to physical SIM slots or even eSIMs.
In the opinion of the chipmaker the recent output put in the succession at minimum possible cost. It also allows manufacturers to create smaller, more compact devices. Which also responsible equally in improving efficiency for smartphone makers.
Additionally, compared to eSIMs iSIMs draw less power. Which makes them ideal for IoT devices, as per Thales, the mobile device security company that has partnered with Qualcomm to develop the tech. As the latest generation of eSIMs they also support the same high-standard security protections.
Qualcomm predicts that global iSIM shipments will reach 300 million by 2027, representing 19% of all eSIM shipments.
Guillaume Lafaix, vice president of embedded products at Thales Mobile and Connectivity Solutions said.
“Alongside the increasingly popular eSIM, the hales 5G iSIM gives device makers and mobile operators even greater freedom to offer their customers effortless over-the-air connectivity, and more exciting and accessible product designs.”
However, Thales has said that iSIMs will be first made available in high-end smartphones and eventually reach entry-level and mid-range smartphones, as well as wearables. The affirmation is yet to besides the Qualcomm whether existing Snapdragon 8 Gen 2 phones, like the Galaxy S23 series, are already iSIM capable.
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