Being the innovator across all leading domains, Samsung Electronics is developing a new bonding wire technology. This is intended for packaging processes in order to achieve high reliability. The same is required in automotive semiconductors. Notably, it’s a next-generation technology that has no existing development, also there would be no existing commercialization cases. Now the info coming, the reliability tests are presently underway by Samsung with partner companies.
As per the industry news, Samsung Electronics is working on developing aluminum oxide (Al2O3) coated bonding wire technology. This is along with MC Electronics and some other post-process partners. The same going to improve reliability and insulation compared to existing bonding wires.
Bonding Wire
Talking about bonding wire then it is a fine metal wire that is used to connect the input and output parts of the chip to the substrate, all in the semiconductor packaging process. While in the existing packaging process, gold(Au), which is excellent flexibility and electrical conductivity. Whereby it is not easy to oxidize has been used as the main material. Although the unit price of gold is more costly, therefore there is an increasing trend to use bonding wires. In order to blend silver (Ag) and copper (Cu) with other metals.
Noticeably, the main problem is such substitute-based wires have low adhesion to insulating and corrosion-resistant materials that are coated on the surface. So if the adhesion is weak, then there is more chance of cracks on the surface of the wire. The same is exposed to high temperature and high humidity environments like automotive semiconductors. And moreover, this is directly related to the decline in the reliability and lifespan of the chip.
Although, one of the bigger challenges at hand is solving the OCB (Off-centered ball) phenomenon. Mostly, the bonding wire forms a round sphere at the end of the wire through hot pressing. It goes through a process of bonding to the electrode. At this time, the ball must be formed straight without tilting for high reliability. Whereas, OCB means that the ball at the end of the wire is tilted in some direction without forming it correctly.
